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  • > Conductive BMC
  • Phase Change Thermal Interface Materials

     

    Features
  • Proprietary technology prevents excessive pump-out after initial burn-in cycle
  • Naturally tacky and heat sink preheating or additional adhesive for attachment
  • are generally not required
  • Low thermal resistance at low pressures
  • It is supplied the in rolls with a top tabbed liner for easy manual or large volume automated operations

  •  

    Applications

  • High frequency microprocessors
  • Notebook and desktop PCs
  • Computer servers
  • Thermal test stands
  • DC/DC Convertors
  • Memory modules
  • Cache chips
  • IGBTs

  •  

     
    Emei PN
    Color
    Thickness
    (inch)
    Thermal
    Conductivity
    (W/m-K)

     
    Phase Change Temperature Range(℃)
     
    "Burn-in"
    Temperature (℃)

     

    Thermal Impedance @ 10psi/50psi (℃-in2/W)
     

    Temperature Range(℃)
     
    Product Data Download (PDF Format)
    E-Phase 800
    White
    0.005-0.02
    2.5
    50℃ to 60℃
    75℃ for 5minutes
    0.025 ~ 0.088
    -40 ~ 130
    E-Phase 7300
    Grey
    0.005-0.02
    4.0
    50℃ to 60℃
    75℃ for 5minutes
    0.081 ~ 0.087
    -40 ~ 130




     

    We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

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