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  • Micro-electronic Material

     

    Micro-electronic Material
    Main Applications
    Products
    -COB adhesive
    -thermally conductive sealnt
    -Underfill
    -Phase change
    -One component epoxy
    -Two components epoxy
    -One component silicone
    -Chip scale elastomers
     

    Model no

    Description

    Characteristic

    Viscosity cPs @25

    Curing Condition

    275-55

    Underfill

    Fast cure, good reworkability

    4K-6K

    120℃ 3-4mins

    400-58

    Surface Mount adhesive

    Fast cure

    200K-250K

    120℃ 20mins

    400-58HF

    Halogen Free SMA

    SMA, fast curing

    250K-350K

    120℃ 20mins

    400-97

    One part epoxy adhesive

    Good flow property

    40K-60K

    125℃ 60mins

    408-14

    COB

    Fast curing,stable

    50K-60K

    120℃ 30mins

    DA-5100

    Die-attach silver epoxy

    High electric conductivity, good for IC Bonding

    Paste

    150℃ 30mins

    EN-706

    medium grade COB adhesive

    Pass reflow and high temperature resistance, pass PCT test

    50K-80K

    150℃ 30mins

    EN-7830

    Premium grade COB adhesive

    Pass PCT and high temperature resistance, high humidity testing

    65K-90K

    150℃ 30mins

    Lord EP-37

    COB

    Halogen free

    45K-55K

    120℃ 30mins

    EB-7408

    COB

    low temperature cure,stable

    40K-50K

    120℃ 30mins

    MA-4508

    Surface Mount adhesive

    SMA, fast curing

    200K-250K

    120℃ 20mins














     

    We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

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