• Inductive Components
  • > Switching Transformer
  • > T Core & Power Choke
  • > SMD Power Inductor
  • > Laminated Transformer
  • > Audio Transformer
  • > Current Sense Transformer
  • > Electronic Ballast
  • > Custom Made Magnetics (OEM Projects)
  • > Fabrication Technology
  • EMI Shielding Materials
  • > Fabric over Foam/Silicone Gaskets
  • > DynaShear / DynaGreen™
  • > GreenShield Gaskets
  • > Conductive Foam
  • > ORS-II
  • > Conductive Elastomers
  • > Absorber-BandSorb®
  • > Conductive Tapes
  • > I/O Shielding Gaskets
  • > Environmental / EMI Shielding
  • > BeCu Fingerstock
  • > Shielded Windows
  • > Vent Panels
  • Bulk Molding Compounds
  • > Home Appliances
  • > Housewares
  • > Electrical Application
  • > Automotive
  • > Conductive BMC
  • Membrane switch / FPC / RFID

     

    Membrane switch / FPC / RFID
    Main Applications
    Products
    -FPC
    -Membrane switch
    -RFID printing
    -Silver Ink
    -Carbon Ink
    -Dielectric
    -Silver through hole (coming soon)
     

    Model no

    Description

    Characteristic

    Viscosity cPs @25

    Curing Condition

    CI-1001

    Conductive silver ink

    High electrical conductivity

    <0.015Ω/□.mil

    120℃ 20mins

    CI-1001B

    Conductive silver ink

    CI-1001 low cost version

    <0.015Ω/□.mil

    120℃ 20mins

    CI-800

    Conductive silver ink

    High electrical conductivity, good adhesion

    <0.012Ω/□.mil

    120℃ 20mins

    CI-801

    Conductive silver ink

    High electrical conductivity, fine printing resolution

    <0.015Ω/□.mil

    120℃ 20mins

    CI-802

    Conductive silver ink

    Low temperature cure

    <0.011Ω/□.mil

    100℃ 30mins

    CI-804

    Conductive silver ink

    For non-thermal resistant substrates e.g. PC

    <0.011Ω/□.mil

    120℃ 30mins

    CI-3090C

    Conductive silver ink

    Higher electrical resistance,lower silver content

    <0.025Ω/□.mil

    120℃ 20mins

    CI-1014

    Conductive silver ink

    Low temperature cure

    <0.015Ω/□.mil

    80℃ 60mins

    CI-4001

    Ag/AgCl ink

    Medical Electrode printing

    12K

    150℃ 2mins

    CI-2001

    Conductive carbon ink

    Abrasion resistance, for silver contacts protection

    <20Ω/□.mil

    110℃ 20mins

    CI-2018

    Conductive carbon ink

    Zebra circuit application, fine resolution

    <12Ω/□.mil

    120℃ 30mins

    CI-2018H

    Conductive carbon ink

    Low resistance, printed circuit application

    <11Ω/□.mil

    120℃ 30mins

    CI-2018L

    Conductive carbon ink

    Low viscosity, mix with CI-2018H

    <50Ω/□.mil

    120℃ 30mins

    CI-2002

    Heater carbon ink

    High temperature resistance, suitable for the printing of heated foils and carpets

    <50Ω/□.mil

    110℃ 20mins

    CI-2022

    heater carbon ink

    High resistivity, for mixing with CI-2002

    <20kΩ/□.mil

    110℃ 20mins

    DI-7502

    UV cure dielectric ink

    Good adhesion

    >800V/mil

    750mJ/cm²

    DI-7502B

    UV cure dielectric ink

    Blue

    >800V/mil

    750mJ/cm²

    DI-7502C

    UV cure dielectric ink

    Transparent

    >800V/mil

    750mJ/cm²

    DI-7502LH

    UV cure dielectric ink

    Halogen free,light green color

    >800V/mil

    750mJ/cm²

    D04-218

    UV cure dielectric ink

    Low Price

    >800V/mil

    750mJ/cm²

    D04-218C

    UV cure dielectric ink

    Transparent

    >800V/mil

    750mJ/cm²

    DI-7521

    UV cure dielectric ink

    High temperature and humidity resistance

    >800V/mil

    750mJ/cm²

    D04-132

    UV cure dielectric ink

    High thickness, for space printing

    >800V/mil

    750mJ/cm²

    DI-701

    Heat cure dielectric ink

    Low Price

    >800V/mil

    120℃ 20mins

    DA-5100

    LED DIE-ATTACH silver epoxy

    High electric conductive, good for IC Bonding

    Paste

    130℃ 90mins

    EC-9519

    SMD LED encapsulant

    Good adhesion to PET, high flexibility and high hardness

    4000 cPs before cure

    750mJ/cm²

    DI-531

    Peelable mask

    Peelable mask for windows protection

    35K-45K

    130℃ 10mins

    T-1001

    solvent

    Solvent for CI-1001, CI-1001B and CI-2018

     

     

    T-1016

    solvent

    Solvent for CI-1016

     

     

    T-1035

    solvent

    Solvent for CI-1035C

     

     

    Outstanding Stability

    EMS CI-1001 shows outstanding stability over Shanghai and China competitors. Please see the below for the conductivity change over time after curing:











     

    We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

    more>>

    Copyright 2005-2018 Emei (HK) Electronics Ltd. All rights reserved1