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  • Printed Circuit Board Assembly

      


     

     

     

     

    Printed Circuit Board Assembly
    Main Applications
    Products
    Conformal coating
    -thermally conductive coating

    -Hot melt adhesive
    -One and two components epoxy systems
    -Silicone and non silicone based heat sink compounds
    -UV conformal coatings
    -Electrically conductive inks (silver and carbon)
    -Surface mount adhesive
     

    Model no

    Description

    Characteristic

    Viscosity cPs

    @25℃

    Curing Condition

    1108

    Hot melt

    UL 94V-0, halogen free, phosphorus free

    Rod or particle

    150-160℃ (melting point)

    2001A-4/600-9B

    Two part potting epoxy

    Slow flow, non-sag, fast cure

    25K

    25℃ 60 mins

    286A/B

    Two part potting epoxy

    2W/mK ,1:1 mixing,
    twin barrel packing, user friendly

    paste

    25℃ 24hrs or
    65℃ 2hrs

    400-58

    Surface mount adhesive

    good adhesion, fast curing

    200K-250K

    120℃ 20mins

    500-71

    Conformal coating

    Low temperature curing

    50K-100K

    60-70℃ 2hrs

    500-71-1

    Conformal coating

    UV tracable version

    50K-100K

    60-70℃ 2hrs














     

      
     
    We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

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