• Inductive Components
  • > Switching Transformer
  • > T Core & Power Choke
  • > SMD Power Inductor
  • > Laminated Transformer
  • > Audio Transformer
  • > Current Sense Transformer
  • > Electronic Ballast
  • > Custom Made Magnetics (OEM Projects)
  • > Fabrication Technology
  • EMI Shielding Materials
  • > Fabric over Foam/Silicone Gaskets
  • > DynaShear / DynaGreen™
  • > GreenShield Gaskets
  • > Conductive Foam
  • > ORS-II
  • > Conductive Elastomers
  • > Absorber-BandSorb®
  • > Conductive Tapes
  • > I/O Shielding Gaskets
  • > Environmental / EMI Shielding
  • > BeCu Fingerstock
  • > Shielded Windows
  • > Vent Panels
  • Bulk Molding Compounds
  • > Home Appliances
  • > Housewares
  • > Electrical Application
  • > Automotive
  • > Conductive BMC
  • bwin2880|www.bwin2880.com|bwin首页

    Our team supplies materials and provide fabrication service on superior polyolefin, urethane and
    silicone materials, insulators and films for use in the communications, computer, transportation
    medical, and consumer markets. These materials are specified in numerous applications
    where function and quality are critical. Our offerings on fabrication materials include
    PORON®, BISCO®, RIC PORON®, Mylar Tape, Nomex® Tape, Formex® etc...

    Due to rapid technical advances and increasingly fierce competition for market share, the theme of modern electronic industry has become “higher performance but more compact in size”. However, this also implies more rigorous heat generation during the operation of the electronic modules. This is why thermal management in the product design is becoming increasing important and the selection of a suitable thermal interface material (TIM) has been frequently integrated as part of the product design process.
    Our range of TIM products provides thermal management solutions for various heat generating electrical equipments. In coping with the changing needs of notebook computers; high performance CPU and chip set; portable electronic equipments, alteration of power supply and expansion module...etc., Emei’s thermal management products has a wide operating temperature range. In addition, the UL ratings for specific product ranges are suitable for application where anti-flammability is an important consideration.
    Thermal Management Products are used by many of the world's OEMs in various industrial applications. These include: automotive, computer, power supply, graphic accelerator chips, flip chip...etc.

    Product UL Information:
    1.UL Number:E310786

    UL Query 1

  • 1.Thermal Grease
  • 2.Phase Change Thermal Interface Materials
  • 3.Thermally Conductive Gap Fillers
  • 4.Insulators
  • 6.Bisco® or Poron®
  • 7.Two-Part Thermally Conductive Silicone Sealant
  • 8.Thermally Conductive Compound
  • 9.Electrically Conductive Interface Pads
  • 10.Thermally Conductive Insulators
  • We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.


    Copyright 2005-2018 Emei (HK) Electronics Ltd. All rights reserved1